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AT93C86A
AT93C86A Ordering Information (1)
AT93C86A-10PU-2.7
Ordering Code
(2)
AT93C86A-10PU-1.8 (2)
AT93C86A-10SU-2.7 (2)
AT93C86A-10SU-1.8 (2)
AT93C86A-10TU-2.7 (2)
AT93C86A-10TU-1.8 (2)
AT93C86AY1-10YU-1.8 (2) (Not recommended for new
design)
AT93C86AY6-10YH-1.8 (3)
AT93C86A-W1.8-11 (4)
Package
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
8Y6
Die Sale
Operation Range
Lead-Free/Halogen-Free/
Industrial Temperature
( ? 40 ° C to 85 ° C)
Industrial Temperature
( ? 40 ° C to 85 ° C)
Notes:
8P3
8S1
8A2
8Y1
8Y6
? 2.7
? 1.8
1.
2.
3.
4.
For 2.7V devices used in a 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables.
“U” designates Green package + RoHS compliant.
“H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
Available in Waffle pack and Wafer form; order as SL788 for inkless Wafer form. Bumped die available upon request. Please
contact Serial EEPROM marketing.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3
mm)
Options
Low Voltage (2.7V to 5.5V)
Low Voltage (1.8V to 5.5V)
11
3408H–SEEPR–1/07
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